EBMP
| Issue No. | 3 | EBMP |
| Issue Dt. | 02.01.15 | |
| Doc. Rev. No. | 0 | |
| Doc. Rev. Dt. | – | |
| MATERIAL OF BIMETALLIC = ELECTROLYTIC GRADE COPPER (MIN.99.9%) & ELECTROLYTIC GRADE ALUMINIUM (MIN.99.5%) BY VOLUME 1:4 MOLECULAR BONDED. | ||
| H | C | W | |
| H1=11Ø | C1=25.0 | C5=50.0 | W00=38 |
| H2=14Ø | C2=32.0 | C6=55 | W0=50 |
| H3=18Ø | C2A=34.0 | C7=OBLONG SLOT TO SUIT C3,C4,C5- PLATE SIZE 80X80 | W1=80 |
| C3=40.0 | W2=100 | ||
| C4=44.5 | C8=OBLONG SLOT TO SUIT C3,C4,C5,C6- PLATE SIZE 100X100 | W3=120 | |
| CATALOG NO. | FIG.NO. | DIMENSIONS-mm. | |
| W | L | ||
| EBMP-2 | I | 38 | 60 |
| EBMP-4 | I | 50 | 60 |
| EBMP-6 | II | 50 | 50 |
| EBMP-8 | II | 60 | 60 |
| EBMP-10 | II | 75 | 75 |
| EBMP-12 | II | 80 | 80 |
| EBMP-14 | II | 100 | 100 |
| EBMP-16 | II | 120 | 120 |
NOTE :
1)PLEASE ADD SUFFIX H1, H2, H3 AS REQUIRED FOR DIAMETER OF 2/4 HOLES H DIA. IN THE PLATE AND ADD SUFFIX C1,C2—-C7,C8 AS REQUIRED FOR CENTRE TO CENTRE DISTANCE C OF 2/4 HOLE IN THE PLATE. FORe.g. CATALOG NO. OFPLATE SIZE 38mm.WIDTH AND 60mm.LONG WITH 14mm. HOLE DIA AND CENTRE TO CENTRE DISTANCE 50.0mm. IS EBMP-2_H2_C5
2)CUSTOM MADE PLATE IS OBTAINED IN THE FOLLOWING CATALOG NO.FORMAT. EBMP-XXXW_XXXL_XX(HOLE DIA.)_XX( HOLE CENTRE)_N. WHERE PREFIX XXX TO W IS THE PLATE WIDTH IN mm. AND PREFIX XXX TO L IS THE PLATE LENGTH IN mm. N= NO. OF HOLES FOR e.g. CATALOG NO. OF PLATE 105 mm.WIDTH 45 mm.LONG WITH 2 HOLES 14mm. HOLE DIA., HOLE CENTRE 33mm. WITH 2 HOLES IS EBMP-105W_045L_H2_33_2.
3) PLATE OF HIGHER THICKNESS T=2mm., 3mm., 4mm. IS OBTAINED BY ADDING SUFFIX TO THE CATALOG TYPE. FOR e.g. CATALOG NO. OF PLATE 2mm.THICK FOR CATALOG TYPE EBMP-12- IS EBMP2-12.